Indium
Indium: shot 4N (99.99%), 25 g; wire 1 mm, 5N (99.999%), 5 g; foil 0.1 mm, 10 x 10 cm. Producer certificate of analysis per lot.
CAS 7440-74-6 | Formula In | MW 114.82
Grades and prices
| Code | Product | Grade | Pack | Price | |
|---|---|---|---|---|---|
| BM-IN-4N-25G | Indium shot | 4N (99.99%) | 25 g | $69 | Request quote |
| BM-IN-5N-5G | Indium wire, 1 mm | 5N (99.999%) | 5 g | $89 | Request quote |
| BM-IN-F-10CM | Indium foil, 0.1 mm | Lot-specific, CoA on request | 10 x 10 cm | $79 | Request quote |
| BM-ITO-50G | ITO powder (indium tin oxide) | Lot-specific, CoA on request | 50 g | $69 | Request quote |
| BM-IN-Q | Indium, other grades and sizes | By quote | By quote | By quote | Request quote |
Specifications
| Property | Value |
|---|---|
| Assay | shot 4N (99.99%); wire 5N (99.999%); foil lot-specific |
| Assay documentation | Producer certificate of analysis for the specific lot, available on request |
| Form | shot, wire, foil |
| Appearance | soft silvery metal |
| Melting point | 156.6 °C (lit.) |
| Boiling point | 2072 °C (lit.) |
| Density | 7.31 g/cm3 (lit.) |
Typical applications
Indium cold-welds under pressure and stays ductile at cryogenic temperatures, so 1 mm wire pressed into a flange groove forms a vacuum-tight seal without heating, and 0.1 mm foil compressed between polished surfaces seals cryostat windows and sample mounts where elastomer O-rings harden and fail. The same conformability makes foil a solid thermal interface layer between a chip and a cold head: the metal flows into surface asperities at modest clamping force.
In soldering, pure indium melts at 156.6 °C and wets glass, quartz, ceramics and metallized surfaces that tin-lead alloys do not. The 52In-48Sn eutectic melts near 118 °C for step-soldering and for joints on temperature-sensitive parts, and indium additions to gold-bearing joints slow gold scavenging. Fusible-alloy work uses indium to push melting points below 100 °C in In-Bi-Sn systems.
ITO, an In2O3/SnO2 mixture commonly near 90:10 by weight, is the standard transparent conductive oxide for display electrodes, OLED anodes and photovoltaic top contacts. The powder is pressed and sintered into sputter targets or dispersed for coated films; 4N shot feeds evaporation and alloying work, including Cu-In-Ga precursor stacks for CIGS absorbers.
Packaging
Shot is packed in sealed polyethylene bottles inside padded cartons. Wire and foil ship in sealed polyethylene sleeves between rigid liners; indium is soft and marks easily, so handle foil by the edges. Each label carries the product code, lot number and net weight. In-stock lots typically dispatch within 2 business days.
Safety and transport
No significant hazards in solid form. See the SDS for full classification.
Solid elemental selenium, tellurium, bismuth and indium are not regulated for transport. Powders, compounds and international air shipments are reviewed before dispatch.