Polycrystalline Heat Spreader Plates
Polycrystalline CVD plates that pull heat out of high-power devices, in wafer sizes to 150 mm.
Polycrystalline CVD diamond carries more than 1000 W·m⁻¹·K⁻¹ at 300 K while expanding at only 1.0 ppm·K⁻¹ and insulating electrically. That combination is what lets a spreader sit directly under a device without shorting it or straining the die.
Plates are finished to a drawing: diameter, thickness and surface roughness are set per order.
- Ultra-high thermal conductivity
- Low thermal expansion coefficient
- Excellent electrical insulation
- Chemical stability and mechanical strength
- Polycrystalline gives the larger size capability; single-crystal gives the higher thermal conductivity
Specifications
| Thermal conductivity at 300 K | > 1000 W·m⁻¹·K⁻¹ |
|---|---|
| Thermal diffusivity at 300 K | > 800 mm²·s⁻¹ |
| Thermal expansion coefficient at 300 K | 1.0 ± 0.1 ppm·K⁻¹ |
| Specific heat capacity at 300 K | 0.502 J·g⁻¹·K⁻¹ |
| Hardness | 81 ± 18 GPa |
| Young's modulus | 1050 GPa |
| Poisson's ratio | 0.1 |
| Density | 3.52 g·cm⁻³ |
| Resistivity | 1.0×10¹² – 1.0×10¹³ Ω·m |
| Surface roughness Ra | < 5 nm |
| Reference sizes | 25, 50, 75, 100, 125, 150 mm diameter (customisable) |
| Thickness | < 1.0 mm (customisable) |
Reference values from the producer datasheet. Dimensions marked customisable are set per order. Request a quote to have a specification confirmed against your drawing.
Applications
Heat spreader plates go wherever the heat flux has outrun copper and the spreader has to stay electrically isolating.
- High-power semiconductor devices, including EV traction power modules
- Optoelectronics: high-power LED lighting and solid-state lasers
- Quantum technology: quantum chips and quantum sensors
- Aerospace