Polycrystalline Heat Spreader Plates
Polycrystalline CVD plates that pull heat out of high-power devices, in wafer sizes to 150 mm.
- Thermal conductivity > 1000 W·m⁻¹·K⁻¹
- Diameters 25 to 150 mm (customisable)
- Thickness < 1.0 mm (customisable)
Thermal Management
Three CVD diamond products for getting heat out of a device: polycrystalline heat spreader plates, single-crystal heat sinks and polycrystalline wafers. Thermal conductivity from 1000 to over 1800 W·m⁻¹·K⁻¹, an expansion coefficient of 1.0 ppm·K⁻¹, and full electrical insulation.
Everything in this section is made to order. Request a quote with the dimensions, thickness and surface finish you need.
Single-Crystal Heat Sinks
Grain-boundary-free single-crystal diamond, the highest thermal conductivity available in a heat sink.
- Thermal conductivity > 1800 W·m⁻¹·K⁻¹
- Reference sizes 24×19 mm down to 7×7 mm (customisable)
- Thickness 0.1 – 5 mm (customisable)
Polycrystalline CVD Wafers
As-grown and polished polycrystalline wafers up to 150 mm, for customers who dice and finish in house.
- Thermal conductivity > 1000 W·m⁻¹·K⁻¹
- Diameters 25 to 150 mm (customisable)
- Surface roughness Ra < 5 nm
Ordering
Made to order: diamond is grown, cut and finished to a drawing, so nothing in this section carries a published price. Send the outline or diameter, the thickness, the surface finish and the tolerances you need with a quote request and we will come back with price and lead time.