Single-Crystal Heat Sinks
Grain-boundary-free single-crystal diamond, the highest thermal conductivity available in a heat sink.
Removing the grain boundaries of the polycrystalline grade takes thermal conductivity above 1800 W·m⁻¹·K⁻¹ at 300 K, the highest available in any heat sink material.
The trade is area. Single-crystal pieces run to 24×19 mm, where the polycrystalline grade goes to 150 mm in diameter.
- Ultra-high thermal conductivity
- Low thermal expansion coefficient
- Excellent electrical insulation
- Chemical stability and mechanical strength
- Polycrystalline gives the larger size capability; single-crystal gives the higher thermal conductivity
Specifications
| Thermal conductivity at 300 K | > 1800 W·m⁻¹·K⁻¹ |
|---|---|
| Thermal diffusivity at 300 K | > 1000 mm²·s⁻¹ |
| Thermal expansion coefficient at 300 K | 1.0 ± 0.1 ppm·K⁻¹ |
| Specific heat capacity at 300 K | 0.502 J·g⁻¹·K⁻¹ |
| Hardness | 70 – 120 GPa |
| Young's modulus | 1050 GPa |
| Poisson's ratio | 0.1 |
| Density | 3.52 g·cm⁻³ |
| Resistivity | 1.0×10¹² – 1.0×10¹³ Ω·m |
| Surface roughness Ra | < 5 nm |
| Reference sizes | 24×19, 15×15, 10×10, 9×9, 8×8, 7×7 mm (customisable) |
| Thickness | 0.1 – 5 mm (customisable) |
Reference values from the producer datasheet. Dimensions marked customisable are set per order. Request a quote to have a specification confirmed against your drawing.
Applications
Single-crystal sinks are specified where the die is small, the flux is extreme and there is no room to spread heat laterally.
- High-power semiconductor devices, including EV traction power modules
- Optoelectronics: high-power LED lighting and solid-state lasers
- Quantum technology: quantum chips and quantum sensors
- Aerospace