Metallised Single-Crystal Heat Sinks
Single-crystal heat sinks with a solderable metal stack, ready to bond directly to a chip or power device.
Diamond is difficult to solder directly, and a bare diamond interface carries a high thermal contact resistance. A multilayer metal film, sputtered or evaporated onto the single-crystal plate, solves both, so the sink solders straight to a semiconductor chip or power device.
The metal stack, layer thickness, outline and substrate thickness are all set per order.
- Ultra-high thermal conductivity in the diamond substrate
- Low thermal expansion, well matched to semiconductor materials
- Diamond substrate keeps its electrical insulation
- Strong metal-diamond bond with low interfacial thermal resistance
- Solders with tin or Au-Sn, or bonds by thermocompression
- Oxidation- and corrosion-resistant metal layer for long-term stability
Specifications
| Thermal conductivity at 300 K | > 1800 W·m⁻¹·K⁻¹ |
|---|---|
| Thermal diffusivity at 300 K | > 1000 mm²·s⁻¹ |
| Thermal expansion coefficient at 300 K | 1.0 ± 0.1 ppm·K⁻¹ |
| Specific heat capacity at 300 K | 0.502 J·g⁻¹·K⁻¹ |
| Hardness | 70 – 120 GPa |
| Young's modulus | 1050 GPa |
| Poisson's ratio | 0.1 |
| Density | 3.52 g·cm⁻³ |
| Metal film stack | Ti-Pt-Au (other stacks customisable) |
| Total metal layer thickness | 0.1 – 3 µm (customisable) |
| Metallisation | Single-sided or double-sided |
| Reference sizes | 28×28, 15×15, 10×10, 9×9, 8×8, 7×7 mm (customisable) |
| Substrate thickness | 0.1 – 5 mm (customisable) |
| Substrate surface roughness Ra | 0.5 – 20 nm |
Reference values from the producer datasheet. Dimensions marked customisable are set per order. Request a quote to have a specification confirmed against your drawing.
Applications
Metallised sinks go where a diamond heat sink has to be soldered straight to the device it cools.
- High-power semiconductor devices, including EV power modules and SiC and GaN RF power devices
- Optoelectronics: high-power LED lighting, solid-state lasers and laser diode arrays
- Quantum technology: quantum chips, quantum sensors and cryogenic optoelectronic devices
- Aerospace